Lub phaj cua sov rau kev sib txuas kho qhov muag lossis semiconductor wafer ua haujlwm yuav tsum tsis yog "pas", tab sis tiaj tus hauv ob peb micrometers. Cov lus qhia tshwj xeeb rau qhov no yog Total Indicated Runout, thiab tau txais nws txoj cai ntawm daim duab qhia tag nrho cov txheej txheem tsim khoom. Ib qho tsis zoo uas tau teev tseg tuaj yeem ua rau muaj kev sib cuag tsis sib xws, qhov chaw kub kub hauv zos, thiab cov khoom tsis lees paub. Ib qhov dej-TIR tshwj xeeb ua kom cov phaj cua sov xa cov thermal hloov mus rau tag nrho cov chaw ua haujlwm- tsis yog- qhov yuav tsum tau sib tham hauv cov ntawv thov raug.
Dab tsi yog Total Indicated Runout (TIR) ntawm Daim Ntawv Kub Kub?
Tag Nrho Indicated Runout yog qhov hloov pauv siab tshaj plaws nyob rau hauv qhov siab ntawm qhov chaw raws li ntsuas los ntawm qhov taw qhia dial thaum ib feem yog tig los yog scanned hla ib cheeb tsam. Rau lub tiaj cua sov phaj, TIR yog qhov tseem ceeb ntawm kev ntsuas ntawm flatness thiab parallelism ua ke. Qhov taw qhia yog zeroed ntawm qhov taw qhia siv, tom qab ntawd txav hla lub phaj ua haujlwm lub ntsej muag. Txhua qhov sib txawv -peak lossis hav- raug kaw. Qhov sib txawv ntawm qhov siab tshaj plaws thiab qis tshaj nyeem ntawv tshaj qhov ntsuas qhov ntsuas yog qhov TIR tus nqi.
Ib qho tshwj xeeb ntawm TIR < 0.025 mm (25 micrometers) tshaj 300 mm txoj kab uas hla txhais tau hais tias tsis muaj taw tes rau saum npoo deviates ntawm lub dav hlau siv los ntawm ntau tshaj ± 0.0125 mm. Rau cov ntawv thov ultra-precision, TIR qhov tseem ceeb tsawg li 0.010 hli lossis txawm tias 0.005 hli yuav xav tau. Qhov xav tau TIR feem ntau yog ua raws li qhov tuab ntawm qhov ua tiav lossis kev tswj qhov sib txawv uas xav tau rau txheej txheej lamination lossis kev sib txuas. Thinner, ntau rhiab qhov chaw (xws li, semiconductor wafers, kho qhov muag iav) thov nruj TIR.
Vim li cas thiaj ua tiav TIR Tight yog qhov nyuaj rau cov phaj cua sov
Lub phaj cua sov tsis yog ib qho yooj yim hlau slab. Nws muaj cov khoom siv hluav taws xob sib xyaw ua ke (ntxuav-hauv lossis clamped hauv grooves) los yog drilled rau cartridge rhaub. Nws tuaj yeem muaj qhov dej thermocouple, qhov txuas txuas, thiab cov cua txias. Cov txheej txheem tsim khoom-machining, vuam, kho cua sov- ua rau muaj kev ntxhov siab sab hauv. Cov kev ntxhov siab no raug tso tawm thaum lub phaj yog rhuab mus rau kev khiav hauj lwm kub, ua rau warpage. Lub phaj uas ntsuas zoo kawg nkaus ntawm chav tsev kub yuav hneev los ntawm 0.1 hli lossis ntau dua ntawm 150 degree.
Hauv kev xyaum,flatness yog qhov kub thiab txias - nyob ntawm cov khoom nyob hauv lub phaj cua sov. Yog li ntawd, kev qhia TIR ib leeg tsis txaus. Qhov kub ntawm qhov ntsuas ntsuas yuav tsum tau hais. Lub phaj cua sov yuav tsum tau teev nrog TIR ntsuas ntawm qhov kub thiab txias (nrog rau kev paub, kev siv tau ntawm qhov kub thiab txias) lossis, qhov zoo tshaj plaws, ntsuas ntawm qhov ntsuas kub ua haujlwm.
Txheej txheem cov kauj ruam kom ua tiav qhov Precision TIR
Ua tiav TIR specification hauv qab 0.025 hli yuav tsum tau ua tib zoo npaj ua ntu zus ntawm kev tsim khoom.
1. Kev nyuaj siab-Ntseev cov khoom tsis muaj
Cov khoom pib-feem ntau yog aluminium alloy (piv txwv li, 6061-T6 lossis 7075) lossis steel (xws li, me me hlau lossis stainless)- yuav tsum muaj kev ntxhov siab-relieved ua ntej tej precision machining. Raws li -tau txais bar lossis phaj Tshuag feem ntau muaj cov kev ntxhov siab seem ntawm dov lossis extrusion. Lub thermal stress-relieving so (piv txwv li, 2-4 teev ntawm 340℃rau txhuas, los yog 600℃rau steel) ua raws li los ntawm qeeb txias tso tawm cov kev ntxhov siab. Yog tsis muaj cov kauj ruam no, tom ntej machining yuav tsis sib npaug ntawm qhov kev ntxhov siab, thiab lub phaj yuav warp thaum lub tshuab cua sov energized.
2. Rough Machining thiab Rhaub Embedding
Lub phaj yog ntxhib machined rau ze -net dimensions. Cov khoom siv cua sov tau nruab (piv txwv li, nrum rau hauv cov xuab zeb pwm rau cam khwb cia- hauv cov cua sov, lossis nias rau hauv cov grooves). Cov kauj ruam no ntxiv cov kev ntxhov siab tshiab vim qhov sib txawv ntawm kev nthuav dav thermal ntawm cov cua sov sheath thiab cov khoom siv phaj. Rau cov ntawv thov TIR precision, lub tshuab rhaub feem ntau yog cam khwb cia rau hauv cov tub ntxhais aluminium cais, uas yog tom qab ntawd kev ntxhov siab -relieved dua ua ntej zaum kawg surfacing.
3. Thermal Stress-Relieving after Assembly
Tom qab cov khoom cua sov tau tag nrho los yog clamped, tag nrho cov phaj sib dhos yog raug rau lwm qhov kev ntxhov siab -relieving thermal voj voog. Qhov no yog qhov tseem ceeb. Cov cua sov los ntawm cov ntsiab lus lawv tus kheej thaum lub voj voog no (powered rau qhov kub siab tshaj qhov kev pab cuam qhov kub thiab txias) ua rau lub hnub nyoog sib dhos thiab ua kom muaj kev ntxhov siab sib txawv. Cov txheej txheem no qee zaum hu ua "thermal cycling" lossis "pre-stabilization."
4. Precision sib tsoo
Qhov chaw ua hauj lwm yog hauv av rau ntawm ib tug loj - hom nto grinder los yog ob tug -disk grinder. Kev sib tsoo tsuas yog qhov kawg ntawm 0.2-0.5 hli ntawm cov khoom siv, ua tiav qhov tiav (Ra) ntawm 0.8 µm lossis zoo dua thiab qhov flatness mus txog lub tshuab muaj peev xwm. Rau daim hlau mus txog 600 mm nyob rau hauv txoj kab uas hla, niaj hnub nto grinder tuaj yeem ua tiav TIR<0.010 mm under controlled conditions.
5. Kawg Lapping (Yeem)
Rau TIR specifications nruj dua 0.010 hli (piv txwv li,<0.005 mm over 200 mm), lapping is required. Lapping uses a fine abrasive slurry between the plate and a precision flat lapping plate. The process is slow but can produce near-optical flatness. Lapped surfaces are typically specified for semiconductor hot chucks or optical bond platen.
Qhia TIR ntawm Daim Duab Engineering
Txhawm rau kom tau txais lub phaj cua sov kom ua tiav raws li qhov yuav tsum tau ua, TIR specification yuav tsum tsis meej thiab ua tiav. Ib qho kev kos duab zoo ib yam tuaj yeem nyeem:
"Total Indicated Runout (TIR) ntawm qhov chaw ua hauj lwm yuav tsum tsis pub tshaj 0.020 hli thaum ntsuas raws li ASME Y14.5M-1994. Kev ntsuas yuav tsum tau ua nrog lub phaj ruaj khov ntawm 100℃± 5℃thoob plaws tag nrho cov chaw ua hauj lwm uas tau txiav txim siab los ntawm txoj kab uas hla D. Tsis muaj qhov sib txawv hauv cheeb tsam ntau tshaj 0.025 mm square."
Cov ntsiab lus tseem ceeb:
TIR limit.
Tus qauv ntsuas (ASME Y14.5 lossis ISO 1101).
Qhov ntsuas kub ntawm qhov ntsuas tau muab coj los ntsuas (chaw kub, kev ua haujlwm kub, lossis ob qho tib si).
Qhov chaw uas TIR siv tau (piv txwv li, "dhau tag nrho cov chaw ua haujlwm" lossis "hauv nruab nrab 80% ntawm lub phaj").
Ib qho ntxiv "loj flatness" yuav tsum tau (piv txwv li, waviness tswj).
Tsis txhob qhia TIR yam tsis tau hais qhov ntsuas kub.Lub phaj uas tiaj tus ntawm chav tsev kub yuav tsis tiaj tus ntawm 150 degree. Rau cov ntawv thov tseem ceeb, cov chaw tsim khoom yuav tsum tau muab daim ntawv qhia kev tiaj tus ntawm ob qho tib si ambient thiab kev khiav hauj lwm kub.
Matching TIR rau Daim Ntawv Thov
Qhov xav tau TIR yuav tsum tau ua raws li cov thickness kam rau ua thiab ua raws li qhov ua tiav.
Thick, rigid parts (e.g., metal sheets >3 hli)- Ib qho TIR ntawm 0.05-0.10 hli tshaj 500 hli tuaj yeem siv tau, raws li qhov yuav ua raws lossis cov thermal paste yuav ua rau qhov khoob.
Nyias, yoog raws cov yeeb yaj kiab lossis wafers (<0.5 mm)- TIR yuav tsum yog<0.025 mm. For semiconductor wafers processed on a vacuum chuck, TIR <0.010 mm is typical.
Optical contacting (tsis muaj nplaum)– TIR<0.005 mm (lapping required).
Laminating nrog nruj substrate– TIR<0.020 mm over the laminate area to avoid voids.
Cov txheej txheem pov thawj
The buyer or end user should verify TIR upon receipt. A simple method uses a dial test indicator mounted on a surface plate. The heating plate is placed on three precision height-adjustable supports set to a reference plane. The indicator is traversed in a grid pattern. For larger plates (>500 mm), lub tshuab ntsuas kev sib koom tes (CMM) lossis laser interferometer muab cov ntaub ntawv raug dua.
Yog tias lub phaj tau teev tseg nrog TIR ntsuas ntawm kev ua haujlwm kub, yuav tsum tau ua qhov ntsuas kub tswj. Lub phaj yog energized rau qhov kev pab cuam setpoint, tso cai rau stabilize (feem ntau 30-60 feeb), thiab ces lub TIR yog ntsuas los ntawm ib tug tshav kub- qhov taw qhia resistant los yog ib tug tsis yog - tiv tauj laser displacement sensor. Thermal expansion ntawm qhov taw qhia sawv ntsug yuav tsum raug kho rau.
Feem ntau yuam kev hauv Kev Qhia TIR
Tshaj - qhia- Thov TIR<0.005 mm when the application only requires 0.05 mm adds unnecessary cost (lapping is expensive).
Tsis nco qab qhov kub thiab txias- Lub TIR tau teev tseg yam tsis muaj qhov ntsuas kub tsis meej. Ib lub chaw tsim khoom tuaj yeem muab chav -kub- pav ca uas hneev nti hauv kev pabcuam.
Tsis quav ntsej mounting qhov- Daim ntawv qhia TIR yuav tsum hais seb qhov ntsuas puas suav nrog thaj chaw ncaj qha ntawm qhov txuas txuas lossis seb cov cheeb tsam puas raug cais tawm. Bolt qhov hauv zos distort saum npoo yog tias bolts overtightened. Daim duab kos yuav tsum qhia cov nqi torque rau mounting.
Tsis muaj kev tswj hwm hauv zos- Lub phaj tuaj yeem ua tau raws li TIR thoob ntiaj teb ntawm 0.025 hli tab sis tseem muaj qhov ntse 0.020 hli hump hla lub voj voog 10 hli -qhov teeb meem "waviness". Ntxiv callouts rau "flatness tshaj ib 25 mm square" tiv thaiv qhov no.
Tus nqi cuam tshuam ntawm TIR Tightening
Kev sib raug zoo ntawm TIR specification thiab cov nqi tsim khoom tsis yog -linear. Ib phaj nrog TIR<0.05 mm can be produced from stress-relieved plate stock using conventional milling and minimal grinding. At TIR <0.025 mm, dedicated grinding and stress-relieving cycles become mandatory. At TIR <0.010 mm, lapping and possibly multiple thermal stabilization cycles are required, doubling or tripling the cost.
Yog li ntawd, tus kws tsim qauv qhia lub phaj yuav tsum tsim kom muaj qhov tsawg kawg nkaus uas tau txais TIR raws li cov txheej txheem physics, tom qab ntawd ntxiv cov npoo kev nyab xeeb me ntsis -tab sis tsis xav kom muaj kev zam nruj heev.
Lub luag haujlwm ntawm Kev Xaiv Khoom
Aluminium (6061 lossis 7075) yog cov khoom siv hluav taws xob ntau tshaj plaws vim nws cov thermal conductivity thiab yooj yim ntawm machining. Txawm li cas los xij, txhuas muaj cov coefficient siab ntawm thermal expansion (23 µm / m·K) thiab tsis tshua muaj zog. Cov phaj loj loj (piv txwv li, 600 mm txoj kab uas hla) yuav sag nyob rau hauv lawv tus kheej qhov hnyav yog tias tsis txhawb nqa kom zoo. Rau qhov xav tau TIR nruj heev, steel (16 µm/m·K) lossis txhuas{10}}silicon carbide composites tuaj yeem siv, tab sis cov no hnyav dua lossis kim dua.
Summary : Koos Loos ua ib daim ntawv cog lus rau kev ua tau zoo
Kev qhiatag nrho qhia runout cua sov phaj specification precisionkom raug ua kom lub platen yuav ua tau nws txoj hauj lwm ntawm kev xa cov kev sib cuag thiab cua sov, thiab cov txheej txheem tsim khoom tuaj yeem ua tau raws li tus qauv. Daim duab kos yog daim ntawv cog lus rau kev ua tau zoo, thiab qhov yuav tsum tau ua kom muaj tseeb yuav tsum tau hais meej meej. Los ntawm kev hais txog TIR txwv, ntsuas qhov ntsuas kub, thaj chaw siv tau, thiab txhua qhov kev txwv hauv zos, tus kws ua haujlwm muab cov chaw tsim khoom nrog lub hom phiaj tsis meej. Qhov tshwm sim yog lub phaj cua sov uas ua tau zoo nyob rau hauv daim ntawv thov precision-txawm yog kev sib txuas ntawm cov lo ntsiab muag kho qhov muag, ua cov khoom siv hluav taws xob semiconductor, lossis laminating hloov pauv hloov pauv. Flatness tsis yog khoom kim heev hauv kev ua haujlwm zoo li no; nws yog tus txheej txheem enabler.
